Shenzhen Dianyingpu Technology Co., Ltd.
Ua kapa ʻia ʻo DYP
Aia ma ke kūlanakauhale ʻo shenzhen i hoʻohui ʻia i ka makahiki 2008, ma ke ʻano he ʻoihana ʻenehana kiʻekiʻe o Kina e hoʻolālā a hana i nā mea kani ultrasonic, e hāʻawi ana i ka lawelawe ʻoihana OEM, ODM, JDM o nā ʻenehana sensor ultrasonic.
Ua loaʻa iā DYP ma mua o 40 mau palapala hoʻoheheʻe, nā palapala hoʻohālike ponoʻī a me nā kope kope. Hoʻohana nui ʻia nā modules sensor ultrasonic ma Smart Agriculture, Smart Cities, Robotic, Industrial IOT, Smart Environment, Transportation territory. Loaʻa i nā noi o Ultrasonic wai pae, Ultrasonic paʻa pae, Automatic feed system, Ultrasonic mamao sensing, Smart parking garage, Automation control, Robotic obstacle avoidance, Objects proximity and awareness with technology accumulation.
Hāʻawi ka hui DYP i nā miliona o nā sensor ma ka honua holoʻokoʻa i kēlā me kēia makahiki, ʻO nā huahana maikaʻi maikaʻi loa a me nā lawelawe maikaʻi e ʻike nui ʻia e nā mea kūʻai aku, ua hoʻohui ʻia kā mākou sensor i nā papahana 5000 ma ka honua holoʻokoʻa. Ua lilo ʻo DYP ʻoihana i mea hoʻolako sensor ultrasonic i makemake ʻia ma ka mākeke Kina.
ʻO ka manaʻo o ka hui ʻo nā mea kūʻai mua, e hana ana i ka waiwai no nā mea kūʻai aku me ka maikaʻi a me ka lawelawe ʻoi aku ka maikaʻi. Makemake ʻo DYP e hoʻomau i ka pilina pili maikaʻi me nā hoa, kākoʻo me kekahi i kekahi, hoʻomohala a holomua pū, hana pū me ka hoʻonui ʻana i ka ʻoihana.
ʻO ka misionari o kā mākou hui e ʻimi i kahi ala e hele ai no ka ʻike akamai, makemake ʻia e alakaʻi i ka ʻoihana ma ka ʻoihana ʻike akamai ma Kina. Hoʻopaʻa ʻia ka filosofia pāʻoihana i ka kūpaʻa, ʻoihana, kūpono, hilinaʻi like a me ka loaʻa kālā, e ʻimi i ka hoʻomohala hoʻomau lōʻihi. Ma hope o nā koi o nā mea kūʻai aku, e hoʻomau i ka hoʻonui ʻana i ka lawelawe, nā huahana a me nā hoʻonā, makemake ʻia e hoʻolako i nā ʻenehana maikaʻi loa, nā huahana a me nā lawelawe ʻenehana loea.
2020 IOTE
(14th) Makana gula o nā huahana hou.
IOTE
Hōʻikeʻike Pūnaewele Pūnaewele o Kina
ʻO ia ka mea nui loa a piha loa i ka IoT expo ma Asia, kahi hōʻike piha piha o ke kaulahao ʻoihana IoT, e komo pū ana me IoT perceptual layer (RFID, Barcode, Smart Card, Smart Sensor), transport network layer (NB-IoT, LoRa, 2G/3G/ 4G/5G, eSIM, Bluetooth, WIFI, GPS, UWB) a me Intelligentapplications layer (Cloud, Mobile Payment, RTLS, New Retail, Industry 4.0, Smart logistics, Smart City, Smart Home).